WAKEFIELD, MA., USA, 8th December 2022. PICMG, a leading consortium for the development of open embedded computing specifications, announces that the COM-HPC committee has finalized pinout and dimension definitions for the form factor COM-HPC Mini in time folder. This means that the vast majority of the details of the COM-HPC Mini standard have been worked out and documentation has already begun. Reaching this critical milestone enables PICMG members to begin design work on compliant modules so that OEMs and embedded developers have access to an elaborate ecosystem soon after the specifications are released. The outstanding performance of the 15 member companies of the COM-HPC Mini task force reflects the strong market relevance and demand for a high-performance credit card-sized computer-on-module standard. Only 12 weeks passed between the approved statement of work and the final definition of the mechanics and the pinout by the working group.
“The definition of COM-HPC Mini happens almost at the speed of light. If the working group maintains this performance, and I see no reason to slow it down as there are no significant technical challenges remaining, I am confident to have a release candidate available for the PICMG release process in Q1 2023 , and a published specification by Q2 2023. I expect early product announcements to be closely tied to the publication date,” says Christian Eder, COM-HPC Technical Committee Chair and Product Marketing Director at congatec.
“The ‘HPC’ in COM-HPC stands for ‘High-Performance Computing’ but we now use it to refer to the ‘High-Performance Crew’ developing the COM-HPC family of specifications. The team’s performance keeps pace with rapidly evolving applications and embedded technologies,” added Jessica Isquith, President of PICMG.
Details about COM-HPC Mini
The COM-HPC Mini pinout specification defines the use of one connector instead of the two implemented for larger COM-HPC client and server modules (sizes A-E), as does COM Express Mini versus COM Express Type 6. But with COM-HPC, half the number of signal pins still means 400 signal lanes, which is 90% of the capacity provided by COM Express Type 6 modules. COM-HPC Mini offers a smaller footprint of 50% compared to Size A COM-HPC Client modules, the smallest COM-HPC form factor currently available. These extremely small modules measuring only 60 x 95 mm are needed for high-end embedded computer logic in devices such as DIN rail PCs for control cabinets in building automation and industrial automation, or devices portable test and measurement devices. Additionally, the new specification will allow engineers to integrate cutting-edge computer interface technologies such as PCIe Gen4 and Gen5 into ultra-small processing units that deliver the best performance. As the new specification will come with a targeted high performance pinout and be compliant with the entire COM-HPC ecosystem, it is expected to become the high-end standard in addition to the earlier PICMG COM Express Mini standard. PICMG expects the COM Express specification to continue to dominate the COM market for many years to come, as it meets many standard application requirements that must now be assigned in the mid-range performance sector.
The working group comprises 15 member companies and is sponsored by ADLINK, Kontron and congatec. Christian Eder of congatec is the chairman and Stefan Milner is the specification editor.
For more information on COM-HPC, visit www.picmg.org/openstandards/com-hpc or purchase the specification for $750 at www.picmg.org/product/com-hpc-module-base-specification-revision- 1-15 .
To learn more about PICMG’s range of open and modular computing standards, visit www.picmg.org.
Founded in 1994, PICMG is a 501(c) nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance industry, industrial IoT, military and aerospace, telecommunications, test and measurement, medicine and general applications. embedded computer applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single-board computer design, high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high availability software. and full system management.
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