High Density Interconnect PCB Market Trends, Opportunities and Forecast to 2027 by End-Use Industry (Smartphones & Tablets, Computers, Telecom/Datacom, Consumer Electronics, Automotive and Others), Technology (Layer 4- 6, 8-10 layer and 10+ layer), number of accumulation layers (1+n+1, 2+n+2, 3+n+3 and others) and region (North America, Europe, Asia- Pacific and rest of the world).
New York, 06 Dec. 2022 (GLOBE NEWSWIRE) — Reportlinker.com announces the publication of the report “HDI PCB Market Trends: Trends, Opportunities and Competitive Analysis” – https://www.reportlinker.com/p06362701/? utm_source=GNW
HDI PCB Market Trends and Forecasts
The future of the High Density Interconnect (HDI) PCB market looks bright with opportunities in the smartphone, computer, telecommunications and data communication, consumer electronics, and automotive sectors. The global HDI PCB market is expected to reach approximately USD 19.1 billion by 2027 growing at a CAGR of 4.7% from 2021 to 2027. The major drivers of this market are consumer electronics market growth, the miniaturization of electronic devices and the growing demand for high performance. devices.
Emerging Trends in the HDI PCB Market
Emerging trends, which directly impact industry dynamics, include miniaturization of electronic devices and growing demand for low-loss/high-speed HDI PCBs.
HDI PCB Market by Segment
The study includes the global High Density Interconnect (HDI) PCB market trends and forecasts by end-use industry, technology, number of build layers, and region as follows:
By end-use industry [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
• Smartphones and tablets
• Computers
• Telecom/Datacom
• Consumer electronics
• Automotive
• Others
By technology [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
• 4-6 layers
• 8-10 layers
• 10+ layers
By building structure [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
• 1+n+1
• 2+n+2
• 3+n+3
• Others
By region [$M and Thousand Sqm shipment analysis for 2016 – 2027]:
• North America
• Europe
• Asia Pacific
• The rest of the world
List of HDI PCB Companies
The companies in the market compete on the basis of the quality of the products offered. The major players in this market are focusing on expanding their manufacturing facilities, R&D investments, infrastructure development and leveraging integration opportunities along the value chain. Through these strategies, HDI PCB companies meet growing demand, ensure competitive efficiency, develop innovative products and technologies, reduce production costs, and expand their customer base. Some of the HDI PCB companies profiled in this report include.
• TTM Technologies, Inc.
• Tripod Technology Company
• AT&S
• Kingboard Holdings Ltd.
• CCTC
• CEO Shengyi Electronics
• Dynamic Electronics Co. Ltd.
• Gold circuit electronics
• Olympic
• DAP
• Unimicron Technology Corp.
• Compeq Manufacturing Co., Ltd.
• Ibiden Co., Ltd.
• Zhen Ding Technology Holding Limited
• Unitech
• Samsung Electro-Mechanics
• Meiko Electronics Co. Ltd.
HDI PCB Market Overview
• The analyst predicts that 4 to 6 layers will remain the most important segment due to the growing demand for smartphones and telecom equipment. The 10+ layers HDI PCB market is expected to witness the highest growth over the forecast period owing to the growing demand for smart wearable devices and connected appliances.
• Smartphones will remain the largest end-use industry due to the growing demand for high performance PCBs and the growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period owing to advancements in automotive electronics.
• Asia-Pacific will remain the largest market and is also expected to experience the highest growth during the forecast period owing to the increase in automotive electronic content and the growth of consumer electronics devices and mobile devices. telecommunications products.
Characteristics of the HDI PCB Market
• Market Size Estimates: Estimated market size for High Density Interconnect (HDI) PCBs in terms of value ($M) and volume (‘000 m²)
• Trend and forecast analysis: market trends (2016-2021) and forecasts (2022-2027) by various segments and regions.
• Segmentation Analysis: High Density Interconnect (HDI) PCB market size by various segments, such as end-use industry, technology and built structure, in terms of value and volume.
• Regional Analysis: High Density Interconnect (HDI) PCB Market Breakdown by North America, Europe, Asia-Pacific and Rest of the World.
• Growth Opportunities: Analyzes growth opportunities across various end-use industries, technologies, built structures, and regions for the High Density Interconnect (HDI) PCB Market.
• Strategic analysis: This includes mergers and acquisitions, new product development, and competitive landscape for the High Density Interconnect (HDI) PCB market.
• Analysis of the competitive intensity of the industry based on Porter’s five forces model.
FAQs
Q1. What is the size of the HDI PCB market?
Answer: The global HDI PCB market is expected to reach approximately $19.1 billion by 2027.
Q2. What is the HDI PCB market growth forecast?
Answer: The HDI PCB market is expected to grow at a CAGR of 4.6% from 2021 to 2027.
Q3. What are the key drivers influencing the growth of the HDI PCB market?
Answer: The main drivers of this market are the growth of the consumer electronics market, the miniaturization of electronic devices and the growing demand for high performance devices.
Q4. What are the main applications or end-use industries of HDI PCBs?
Answer: Smartphones, tablets and computers are the main end-use industries of the HDI PCB market.
Q5. What are the emerging trends in the HDI PCB market?
Answer: Emerging trends, which directly impact industry dynamics, include the miniaturization of electronic devices and the growing demand for low-loss/high-speed HDI PCBs.
Q6. Who are the major HDI PCB companies?
Answer: Some of the major HDI PCB companies are:
• TTM Technologies, Inc.
• Tripod Technology Company
• AT&S
• Kingboard Holdings Ltd.
• CCTC
• CEO Shengyi Electronics
• Dynamic Electronics Co. Ltd.
• Gold circuit electronics
• Olympic
• DAP
• Unimicron Technology Corp.
• Compeq Manufacturing Co., Ltd.
• Ibiden Co., Ltd.
• Zhen Ding Technology Holding Limited
• Unitech
• Samsung Electro-Mechanics
• Meiko Electronics Co. Ltd.
Q7.
Which segment of HDI PCB technology will be most important in the future?
Answer: The analyst predicts that layers 4 to 6 will remain the most important segment due to the growing demand for smartphones, telecommunications and data communication. The 10+ layers HDI PCB market is expected to witness the highest growth over the forecast period owing to the growing demand for smart wearable devices and connected appliances.
Q8: In the HDI PCB market, which region is expected to be the biggest in the next 5 years?
Answer: Asia Pacific is expected to remain the largest and fastest growing region over the next 5 years.
Q9. Are we getting personalization in this report?
Answer: Yes, the analyst provides 10% customization at no additional cost.
This report answers the following 11 key questions
Q.1 What are some of the most promising potential growth opportunities for the global High Density Interconnect (HDI) PCB market by end-use industry (smartphones & tablets, computers, telecom/datacom, consumer electronics, automotive and others), technology (4-6 layers, 8-10 layers, 10+ layers), number of accumulation layers (1+n+1, 2+n+2, 3+n+3 and others) and region (North America, Europe, Asia-Pacific and Rest of the World)?
Q.2 Which segments will experience faster growth and why?
Q.3 Which regions will experience faster growth and why?
Q.4 What are the major factors affecting market dynamics? What are the High Density Interconnect (HDI) PCB Market Drivers and Challenges?
Q.5 What are the Business Risks and Threats to the High Density Interconnect (HDI) PCB Market?
Q.6 What are the emerging trends in the High Density Interconnect (HDI) PCB market and the reasons behind them?
Q.7 What are the changing customer demands in the High Density Interconnect (HDI) PCB market?
Q.8 What are the new developments in the High Density Interconnect (HDI) PCB market? Which companies are leading these developments?
Q.9 Who are the major players in the High Density Interconnect (HDI) PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competing products and processes in the High Density Interconnect (HDI) PCB market and what threat do they pose for loss of market share through material or product substitution?
Q.11 What M&A activities have taken place in the past five years in the High Density Interconnect (HDI) PCB market?
For Any Query Related to High Density Interconnect (HDI) PCB Market or High Density Interconnect (HDI) PCB Market Share, High Density Interconnect (HDI) PCB Market Analysis and For the size of the High Density Interconnect (HDI) PCB market, email Lucintel analysts at helpdesk@lucintel.com. We will be happy to answer you soon.
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